{"updated": "2026-05-11", "verifiedAt": "2025-12-15", "ticker": "^SOX", "name": "PHLX Semiconductor Sector Index", "methodology_cn": "Nasdaq PHLX 自营,30 只成分,修正市值加权,单只权重上限 8%,每季度第三个周五再平衡。", "methodology_en": "Maintained by Nasdaq PHLX; 30 components; modified market-cap weighted with an 8% single-stock cap; rebalanced quarterly.", "source": {"name": "Wikipedia · PHLX Semiconductor Sector", "url": "https://en.wikipedia.org/wiki/PHLX_Semiconductor_Sector"}, "members": [{"ticker": "NVDA", "name": "NVIDIA", "country": "United States", "code": "US", "subsector": "logic_fabless"}, {"ticker": "AVGO", "name": "Broadcom", "country": "United States", "code": "US", "subsector": "logic_fabless"}, {"ticker": "AMD", "name": "Advanced Micro Devices", "country": "United States", "code": "US", "subsector": "logic_fabless"}, {"ticker": "QCOM", "name": "Qualcomm", "country": "United States", "code": "US", "subsector": "logic_fabless"}, {"ticker": "MRVL", "name": "Marvell Technology", "country": "United States", "code": "US", "subsector": "logic_fabless"}, {"ticker": "MPWR", "name": "Monolithic Power Systems", "country": "United States", "code": "US", "subsector": "logic_fabless"}, {"ticker": "TSM", "name": "Taiwan Semiconductor Mfg.", "country": "Taiwan", "code": "TW", "subsector": "foundry"}, {"ticker": "GFS", "name": "GlobalFoundries", "country": "United States", "code": "US", "subsector": "foundry"}, {"ticker": "MU", "name": "Micron Technology", "country": "United States", "code": "US", "subsector": "memory"}, {"ticker": "ASML", "name": "ASML Holding", "country": "Netherlands", "code": "NL", "subsector": "equipment"}, {"ticker": "AMAT", "name": "Applied Materials", "country": "United States", "code": "US", "subsector": "equipment"}, {"ticker": "LRCX", "name": "Lam Research", "country": "United States", "code": "US", "subsector": "equipment"}, {"ticker": "KLAC", "name": "KLA Corporation", "country": "United States", "code": "US", "subsector": "equipment"}, {"ticker": "TER", "name": "Teradyne", "country": "United States", "code": "US", "subsector": "equipment"}, {"ticker": "ENTG", "name": "Entegris", "country": "United States", "code": "US", "subsector": "equipment"}, {"ticker": "ACLS", "name": "Axcelis Technologies", "country": "United States", "code": "US", "subsector": "equipment"}, {"ticker": "AMKR", "name": "Amkor Technology", "country": "United States", "code": "US", "subsector": "equipment"}, {"ticker": "COHR", "name": "Coherent Corp.", "country": "United States", "code": "US", "subsector": "equipment"}, {"ticker": "TXN", "name": "Texas Instruments", "country": "United States", "code": "US", "subsector": "analog"}, {"ticker": "ADI", "name": "Analog Devices", "country": "United States", "code": "US", "subsector": "analog"}, {"ticker": "ON", "name": "ON Semiconductor", "country": "United States", "code": "US", "subsector": "analog"}, {"ticker": "MCHP", "name": "Microchip Technology", "country": "United States", "code": "US", "subsector": "analog"}, {"ticker": "NXPI", "name": "NXP Semiconductors", "country": "Netherlands", "code": "NL", "subsector": "analog"}, {"ticker": "ALGM", "name": "Allegro MicroSystems", "country": "United States", "code": "US", "subsector": "analog"}, {"ticker": "INTC", "name": "Intel", "country": "United States", "code": "US", "subsector": "idm"}, {"ticker": "LSCC", "name": "Lattice Semiconductor", "country": "United States", "code": "US", "subsector": "logic_fabless"}, {"ticker": "RMBS", "name": "Rambus", "country": "United States", "code": "US", "subsector": "logic_fabless"}, {"ticker": "QRVO", "name": "Qorvo", "country": "United States", "code": "US", "subsector": "rf"}, {"ticker": "SWKS", "name": "Skyworks Solutions", "country": "United States", "code": "US", "subsector": "rf"}, {"ticker": "WOLF", "name": "Wolfspeed", "country": "United States", "code": "US", "subsector": "analog"}], "subsectors": [{"id": "logic_fabless", "name_cn": "逻辑 / Fabless 设计", "name_en": "Logic / Fabless Design", "note_cn": "拿掉了制造,只做芯片设计;AI 周期里最直接的受益者。", "note_en": "Design-only houses without fabs — the most direct beneficiaries of the AI buildout.", "tickers": ["NVDA", "AVGO", "AMD", "QCOM", "MRVL", "MPWR", "LSCC", "RMBS"], "count": 8}, {"id": "foundry", "name_cn": "晶圆代工", "name_en": "Pure-play Foundry", "note_cn": "为 fabless 客户代工生产;TSM 一家拿走全球先进制程 60%+ 的产能。", "note_en": "Contract manufacturers for fabless customers. TSM alone holds 60%+ of leading-edge capacity.", "tickers": ["TSM", "GFS"], "count": 2}, {"id": "memory", "name_cn": "存储 (DRAM / NAND)", "name_en": "Memory (DRAM / NAND)", "note_cn": "全行业最强周期股。SOX 里仅 MU 一家;另两巨头 Samsung、SK 海力士不在美股标的。", "note_en": "The most cyclical sub-industry. MU is the only pure-play in SOX; Samsung and SK Hynix sit on KOSPI.", "tickers": ["MU"], "count": 1}, {"id": "equipment", "name_cn": "设备 / 材料", "name_en": "Equipment & Materials", "note_cn": "ASML 的 EUV 是全行业卡脖子环节;AMAT/LRCX/KLAC 三大美国设备厂。", "note_en": "ASML's EUV is the industry's choke point. AMAT/LRCX/KLAC are the three big US equipment houses.", "tickers": ["ASML", "AMAT", "LRCX", "KLAC", "TER", "ENTG", "ACLS", "AMKR", "COHR"], "count": 9}, {"id": "analog", "name_cn": "模拟 / 混合信号", "name_en": "Analog / Mixed-Signal", "note_cn": "汽车、工业、消费电子的「水电气」;周期跟着工业 PMI 走,不是 AI。", "note_en": "The 'water and electricity' of cars, industrial machines and consumer devices. Cycle follows PMI, not AI.", "tickers": ["TXN", "ADI", "ON", "MCHP", "NXPI", "ALGM", "WOLF"], "count": 7}, {"id": "rf", "name_cn": "射频 / 通信", "name_en": "RF / Wireless", "note_cn": "手机射频前端;高度集中在 Apple 供应链。", "note_en": "Mobile RF front-end — heavily indexed to the Apple supply chain.", "tickers": ["QRVO", "SWKS"], "count": 2}, {"id": "idm", "name_cn": "IDM(自有晶圆厂)", "name_en": "IDM (own-fab)", "note_cn": "Intel 是全行业最大的转型故事;曾经垄断的 IDM 模式正在让位给 fabless + 代工。", "note_en": "Intel — the industry's biggest transformation story; the IDM model is giving way to fabless + foundry.", "tickers": ["INTC"], "count": 1}], "memoryFocus": {"title_cn": "存储:周期之王,但 SOX 里只剩 MU 一家", "title_en": "Memory — the cycle king, but only MU survives in SOX", "lede_cn": "存储是半导体里振幅最大的一档:2017 牛市 DRAM ASP 翻倍,2019 熊市再砍一半,2023 全行业经营亏损,2024 在 HBM 拉动下再次反转。SOX 里只剩 MU 一家纯存储,另外两家 — Samsung 与 SK 海力士 — 上的是 KOSPI。这意味着你买 SMH 等于在「全球存储行业市值」上欠配了 60%。", "lede_en": "Memory is the most volatile sub-industry: DRAM ASPs doubled in the 2017 boom, halved in the 2019 bust, the entire industry posted operating losses in 2023, then snapped back in 2024 on HBM demand. MU is the only pure-play in SOX; the other two — Samsung and SK Hynix — trade on KOSPI. Owning SMH leaves you ~60% underweight global memory market cap.", "players": [{"ticker": "MU", "name": "Micron Technology", "country": "United States", "code": "US", "inSox": true, "share_dram": "≈25%", "share_nand": "≈12%", "note_cn": "美股唯一纯存储标的;HBM3E 已上量,2026 切到 HBM4。", "note_en": "The only US-listed pure memory play; HBM3E in production, HBM4 ramps 2026."}, {"ticker": "005930.KS", "name": "Samsung Electronics", "country": "South Korea", "code": "KR", "inSox": false, "share_dram": "≈40%", "share_nand": "≈32%", "note_cn": "全球最大存储厂,但同时做手机、面板、晶圆代工;并非纯存储 beta。", "note_en": "Largest memory maker, but also phones, displays, and a foundry — not a pure memory beta."}, {"ticker": "000660.KS", "name": "SK Hynix", "country": "South Korea", "code": "KR", "inSox": false, "share_dram": "≈35%", "share_nand": "≈18%", "note_cn": "HBM 全球第一供应商,英伟达最大单一存储客户。", "note_en": "World's #1 HBM supplier; Nvidia's largest single memory customer."}], "hbm_note_cn": "HBM(高带宽存储)是 AI 训练芯片的标配。2022 还是 ~$1B 的小生意,彭博、TrendForce 一致预计 2026 行业规模将突破 $30B,占 DRAM 整体收入接近 30%。SK 海力士、Samsung、Micron 三分天下,份额约 50/35/15。", "hbm_note_en": "HBM (high-bandwidth memory) is the AI training accelerator's standard. From ~$1B in 2022, Bloomberg and TrendForce consensus puts the market past $30B by 2026 — roughly 30% of total DRAM revenue. SK Hynix / Samsung / Micron split the market approximately 50 / 35 / 15."}}